Electronic packaging Write for us
Adhesion techniques are among the most important elements of packaging technology for electronic products. Recently, advanced adhesives for electronic packaging have diversified, along with remarkable advances in microsystems. Adhesives must exhibit functions such as electrical and thermal conductivities in some cases, but achieving a reliable bond is an immutable requirement.
This chapter identifies and explains in detail the main factors which determine the bond strength of adhesive joints, with the aim of establishing adequate guidelines for the development of advanced adhesives from the point of view of reliable adhesion. Although the chemical composition of adhesive compounds appears complex, their design is derived from the basic theory of adhesion and bonding, which is briefly presented in this chapter.
Adhesives are often named for their type of polymer. The main types of polymers used in electronic packaging are epoxies, silicones, acrylics, polyurethanes, polyimides and cyanate esters. Some generic properties apply to each type but be careful when generalizing as there are hundreds of formulations of each type on the market, each with minor or major property differences.
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